Micro Cut M3.02 – Silicone-Free Micro Polishing Compound
Micro Cut M3.02 is a professional silicone-free micro polishing compound developed for the permanent removal of holograms, fine scratches and sanding marks up to P3000 grit. It refines paint surfaces precisely and creates a brilliant high-gloss finish, even under extreme lighting conditions.
After heavy compounding, paint often shows haze or micro-marring. Therefore, a dedicated micro polish is essential to achieve a flawless surface. Micro Cut M3.02 eliminates imperfections mechanically rather than covering them, which ensures long-lasting correction results.
Removes Holograms and Fine Scratches Permanently
With a cut level of 3.2 and gloss rating of 9.0, this polishing compound balances correction and shine effectively.
It removes:
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Holograms
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Fine scratches
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Sanding marks up to P3000
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Micro-marring from previous polishing steps
Moreover, the highly homogeneous aluminium oxide abrasives break down evenly. As a result, the polish delivers consistent refinement across all modern paint systems, including scratch-resistant finishes.
Ideal for Dark and Sensitive Paint Systems
Micro Cut M3.02 creates a deep and clear gloss even on dark or sensitive colours. Because the formula contains no silicone oils, it ensures compatibility with body shops and repainting environments.
Furthermore, the compound remains economical and easy to wipe off without leaving residue.
Application Instructions
For best results, use a Micro Cut Pad with an orbital polisher featuring forced rotation (e.g., Makita PO5000C at high speed). Alternatively, a rotary polisher can also be used.
Before polishing, fully moisten new or dry pads with product. Apply evenly with the machine switched off. Then polish crosswise with medium pressure until a transparent film appears. This indicates that the abrasive particles have fully broken down.
Remove residues with a non-chain-stitched, ultrasonically cut microfibre cloth.
Important Notes
Shake before use. Do not apply on hot surfaces. Always test compatibility prior to full application.
For complete technical details, refer to the Documents section.


















